展会回顾 | TestConX 2025测试耗材、测试单元集成和测试操作的卓越盛会圆满收官！期待再会！

JCM Successfully Concludes TestConX 2025 in Arizona, USA!

我司参展的TestConX 2025展会已于3月5日在美国亚利桑那州圆满落幕！此次展会期间，我们展示了公司主营的高性能工程塑料材料及日本Tulip品牌的测试针，并与众多来自全球的客户、合作伙伴及行业专家进行了深入交流。

这次展会汇集了从封装半导体功能/Final Test和burn-in扩展到电子测试的所有实际方面，包括验证、高级封装测试、系统级测试、模块测试以及成品测试，展示了最新的技术和研究成果，为行业未来发展注入了新的活力。

The TestConX 2025 exhibition, held from March 2nd to March 5th in Arizona, USA, has successfully concluded. During the event, JCM showcased our high-performance engineering plastics and Japanese Tulip brand test probes, engaging in in-depth discussions with numerous customers, partners, and industry experts from around the world.

TestConX 2025 brought together all practical aspects of semiconductor packaging/final test and burn-in, extending to electronic testing fields such as validation, advanced packaging test, system-level test, module test, and final product test. The exhibition presented the latest technologies and research findings, injecting new vitality into the future development of the industry.

JCM在本次盛会中，带来了我们的明星产品，高温工程塑料SCM6R10(新品)、SCM6R00(新品）SCM5100、SCM5130、、SCM8000、特殊材料SumikaSuper S1000、特殊材料R2000等产品，获得了参会人员的广泛关注和好评。

During the event, JCM introduced our star products, including high-temperature engineering plastics like SCM6R10 (new),SCM6R00 (new), SCM5100, SCM5130, SCM8000, as well as special materials such as SumikaSuper S1000 and R2000，These products received wide recognition and positive feedback from attendees.

我们的高温工程塑料最高能够在400℃极端温度条件下保持卓越的性能，确保晶圆测试过程的可靠性和精确性。我们代理的日本Tulip测试针同样以其高耐磨性和精确度著称，广泛应用于各种半导体测试设备中。

Our high-temperature engineering plastics can withstand extreme temperatures up to 400°C while maintaining outstanding performance, ensuring the reliability and accuracy of the wafer testing process. Additionally, the Japanese Tulip test probes we represent are widely recognized for their high wear resistance and exceptional precision, making them ideal for various semiconductor testing equipment.

盛会期间的社交活动同样精彩纷呈，为参会者提供了一个轻松交流的平台，增进了彼此之间的联系和友谊，大家在轻松愉快的环境中交流心得、拓展人脉。

The exhibition was also enriched by a series of networking activities, providing participants with a relaxed and friendly platform to connect, share insights, and expand their professional networks.

此次TestConX 2025盛会不仅展示了测试领域的最新技术和趋势，更为行业未来的发展提供了重要的指引。

TestConX 2025 not only showcased the latest technologies and trends in the testing field but also provided valuable guidance for the future development of the industry.

在此，我们衷心感谢所有莅临展位的客户及合作伙伴。未来，我们将继续致力于提供高品质的工程塑料材料，以及高性能的测试针产品，更好的服务于客户，感谢您对我们的关注与支持。

We would like to extend our sincere gratitude to all customers and partners who visited our booth. Moving forward, JCM will remain committed to providing high-quality engineering plastics and high-performance test probes, continuously striving to offer superior solutions to our valued customers.

Thank you once again for your attention and support，We look forward to seeing you again at future events!

嘉畅美下期展会预告

2025新加坡半导体技术展览会SEMICON Southeast Asia

新加坡半导体展会聚焦于半导体行业的最新技术趋势、市场动态以及创新解决方案，为参展商和参观者提供了一个集展览、会议、网络构建于一体的综合平台。展会覆盖半导体制造的整个产业链，包括设备、材料、设计、制造、测试、封装和服务等各个环节。参展商包括来自全球各地的半导体设备制造商、材料供应商、设计公司、晶圆厂、封测企业及各类服务提供商。除了展览外，展会还设有多个专题论坛、技术研讨会和行业峰会，邀请行业专家就半导体技术的未来发展、市场趋势、供应链合作等话题进行深入交流。对于寻求业务拓展、寻找新供应商、探索新技术和解决方案的专业人士而言，SEMICON Southeast Asia是获取行业资讯、建立合作关系的理想场所。

时间：2025年5月20日-22日

展会地点：新加坡滨海湾金沙会展中心

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新品-SCM6R00 高性能聚合物材料

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